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SAW Components The steady improvement in smartphone performance is driving the demand for more compact electronic components. In particular, there is an acute need for smaller SAW devices that transmit and receive signals at certain frequencies. In order to support multiple band operation, middle–class smartphones for specific regions use 14 or 15 SAW devices while premium models with global compatibility may adopt as many as 30 to 40 SAW devices. By fully revising the chip design and packaging approach making use of its own proprietary design and miniaturization technology, Murata has developed the Products with characteristics equal or superior to those of conventional products while simultaneously achieving the world's smallest size. JP-31_dup_fil_2.jpg ダウンロード
XBAR Filter Developed by combining Murata’s proprietary Surface Acoustic Wave (SAW) filter expertise with XBAR technology from Murata's subsidiary Resonant Inc., it enables the extraction of desired signals while achieving both low insertion loss and high attenuation. JP-31_XBAR-RESIN.png ダウンロード
MEMS inertial Force sensor (accelerometer/gyroscope integrated type) Integrated sensor that can simultaneously detect acceleration and angular velocity, and can detect impact and rotation. Equipped with high–precision, high–stability sensing utilizing 3D MEMS technology and a wide range of self–diagnosis functions, it is suitable for applications that require high stability even in harsh environments. JP-31_MEMS.jpg ダウンロード
Pressuer Sensor This barometric pressure sensor uses capacitance MEMS technology to achieve low current consumption and low noise. It has a waterproof structure and can be used even in environments that require high durability and waterproof. JP-31_Barometiric.jpg ダウンロード
AMR Sensors (Magnetic Sensors) These products are magnetic sensors using AMR elements whose resistance varies according to the strength or direction of the magnetic field. Combination with a magnet permits non–contact rotation detection or position detection. JP-31_AMRsensor.jpg ダウンロード
Soil sensor Murata’s soil sensor has been developed to continuously monitor and visualize the condition of the soil and water quality in agriculture. Three sensors are built into a single package, which enables simultaneous measurement of electrical conductivity (EC), moisture (volumetric water content: VWC), and temperature in the soil or water. In particular, the industry’s first–ever nine–electrode EC sensor has multiple measuring patterns and original algorithms that help eliminate uncertainty. JP-31_soil.JPG ダウンロード
Single Layer Microchip Capacitors Thin Film Circuit Substrates (RUSUB) A gold metal film is formed on the front and back surfaces of a single–layer ceramic substrate, and a capacitor or custom circuit board is formed. It is mainly used for optical communication and mobile phone base stations. JP-31_mcrchp-rusub.jpg ダウンロード
Multilayer LCP Product Multilayer LCP Product was born with a combination of LTCC lamination technology and LCP resin, based on the concept of a curved multilayer substrate for high frequency. LCP is less loss of GHz band, since there is no characteristic deterioration due to moisture, it has been known for a long time that it is suitable for smartphone applications. However, it was thought that it was difficult to make a multilayer substrate and could not be put to practical use. Murata became the first in the world to mass–produce a multi–layered technology. JP-31_MetoroCirc.jpg ダウンロード

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